Lamina Thermal Management

In traditional light sources such as incandescent or fluorescent, much of the energy lost in generating visible light is dissipated as heat in the radiant beam of light. Fixtures surrounding these traditional light sources such as shade or reflectors, or surfaces illuminated by these sources can and will experience thermal rise above ambient, depending on the efficiency and intensity of the light source used. Solid state lighting (LED) is more efficient at generating visible light than many "filament" type light sources. However, the heat energy developed during operation of LEDs does not radiate away from the LED in the light beam area, but conducts back through the semiconductor, into the package material and heat sink.

Lamina utilizes a patented semiconductor packaging technology that is extremely efficient at removing thermal energy (i.e., low thermal resistance from junction to case) from the semiconductor and transferring it into a heat sink. This packaging technology has been in successful use in numerous high power modules and packages in excess of 100 watts for several years.

Construction of a Lamina Atlas™ Series High Power LED

Lamina's unique light source products achieve the highest lighting density of solid state devices with values exceeding 1400 lumens per square inch. Achieving these high densities and high light output values requires the user to carefully plan the thermal management as a "system" considering not only the light source, but the heat sink and thermal interface materials used in the design.

For more information on Thermal Management, please review Lamina Application Note 02 entitled Thermal Management of Lamina High Brightness Light Sources.